IC Package design engineer- 4+ Years

Seeking a lead engineer to drive the package design process for Cisco's next-generation silicon solutions. Oversee planning, optimisation, and execution of advanced package designs, collaborating with multidisciplinary teams. Ideal for candidates with over 3 years' experience in high-speed layout design and proficiency in Cadence APD tools.

• Experience: 3+ years
• Seniority: Mid Level
• Languages: English