Firmware Engineer (USB & OpenBMC) - REQ_2942
Tessolve Semiconductor Private Limited
Description
Areas of Responsibility: Skills: Firmware, Embedded C, C++, OpenBMC, OBMF-ICP, PLDM OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components. Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP. Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness. OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities. Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices. Key Skills: OCP DC-SCM/DC-MHS, USB Experience: 1 - 5 years of experience Expert embedded C, strong C++ BMC / platform-management firmware experience (OpenBMC strongly preferred) DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V Yocto/BitBake, CMake/Meson, Git, CI Understanding of I2C/SMBus, SPI, UART, USB, GPIO Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics
Eligibility Criteria
- Experience: 1+ year
- Seniority: Entry Level
- Languages: English
About Tessolve Semiconductor Private Limited
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3200+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs.